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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. :HE9521 Issued Date : 1997.06.18 Revised Date : 2002.04.10 Page No. : 1/4 HM2222A NPN EPITAXIAL PLANAR TRANSISTOR Description The HM2222A is designed for general purpose amplifier and high speed, medium-power switching applications. Features * Low collector saturation voltage * High speed switching * For complementary use with PNP type HPN2907A SOT-89 Absolute Maximum Ratings * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature .................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) .................................................................................... 1.2 W * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ......................................................................................... 75 V VCES Collector to Emitter Voltage ...................................................................................... 40 V VEBO Emitter to Base Voltage .............................................................................................. 6 V IC Collector Current........................................................................................................ 600 mA Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO ICEX IEBO *VCE(sat)1 *VCE(sat)2 *VBE(sat)1 *VBE(sat)2 *hFE1 *hFE2 *hFE3 *hFE4 *hFE5 *hFE6 fT HM2222A Min. 75 40 6 35 50 75 100 40 50 300 Typ. - Max. 10 10 50 300 1 1.2 2 300 - Unit V V V nA nA nA mV V V V Test Conditions IC=10uA IC=10mA IE=10uA VCB=60V VCB=60V, VEB(off)=3V VEB=3V IC=150mA, IB=15mA IC=500mA, IB=50mA IC=150mA, IB=15mA IC=500mA, IB=50mA VCE=10V, IC=100uA VCE=10V, IC=1mA VCE=10V, IC=10mA VCE=10V, IC=150mA VCE=10V, IC=500mA VCE=1V, IC=150mA VCE=20V, IC=20mA, f=100MHz *Pulse Test: Pulse Width 380us, Duty Cycle2% HSMC Product Specification MHz HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 1000 Spec. No. :HE9521 Issued Date : 1997.06.18 Revised Date : 2002.04.10 Page No. : 2/4 Current Gain & Collector Current 125 C o 75 C o 125 C o 75 C o 25 C o 25 C o hFE 100 hFE hFE @ VCE=1V 100 hFE @ VCE=10V 10 0.1 1 10 100 1000 10 0.1 1 10 100 1000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 1000 VCE(sat) @ IC=10IB 10000 Saturation Voltage & Collector Current VCE(sat) @ IC=38IB 75 C Saturation Voltage (mV) Saturation Voltage (mV) o 1000 75 C o 125 C 100 25 C o o 125 C 100 25 C o o 10 0.1 1 10 100 1000 10 1 10 100 1000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 10000 VBE(s at) @ IC=10IB Capacitance & Reverse-Biased Voltage 100 Saturation Voltage (mV) 1000 75 C 25 C o o Capacitance (pF) 10 125 C o Cob 100 0.1 1 10 100 1000 1 0.1 1 10 100 Collector Current-IC (mA) Reverse Biased Voltage (V) HM2222A HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. :HE9521 Issued Date : 1997.06.18 Revised Date : 2002.04.10 Page No. : 3/4 Cutoff Frequency & IC 1000 10000 PT=1ms PT=100ms Safe Operating Area Cutoff Frequency (MHz).. . VCE=20V Collector Current-IC (mA) 1000 PT=1s 100 100 10 10 1 10 100 1000 1 1 10 100 Collector Current (mA) Forward Biased Voltage-VCE (V) HM2222A HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. SOT-89 Dimension Marking: Spec. No. :HE9521 Issued Date : 1997.06.18 Revised Date : 2002.04.10 Page No. : 4/4 C H Date Code HM 2222A Laser Marking B 1 E F G A 2 3 D Style: Pin 1.Base 2.Collector 3.Emitter I 3-Lead SOT-89 Plastic Surface Mounted Package HSMC Package Code: M *: ypical DIM A B C D E Inches Min. Max. 0.1732 0.1811 0.1594 0.1673 0.0591 0.0663 0.0945 0.1024 0.0141 0.0201 Millimeters Min. Max. 4.40 4.60 4.05 4.25 1.50 1.70 2.40 2.60 0.36 0.51 DIM F G H I Inches Min. Max. 0.0583 0.0598 0.1165 0.1197 0.0551 0.0630 0.0138 0.0161 Millimeters Min. Max. 1.48 1.52 2.96 3.04 1.40 1.60 0.35 0.41 Notes: 1.Dimension and tolerance based on our Spec. dated May. 05,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: L94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HM2222A HSMC Product Specification |
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